How will this affect its mechanical properties (strength, ductility)? Hint: think about how the motion of dislocations is blocked by grain boundaries.

How will this affect its mechanical properties (strength, ductility)? Hint: think about how the motion of dislocations is blocked by grain boundaries.

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Problem 1xc) Stirling Expansion Stroke During the isothermal expansion stroke of the idealized Stirling cycle shown, the right hand piston remains fixed as the left hand piston travels downward. Problem 2xc The steam accumulator shown is used to maintain a ready source of new steam at 300°C. A piston of 63.6 metric tonnes maintains the required pressure, and the top of the cylinder is open to the atmosphere. 1 metric tonne = 1,000 kg The initial cold condition is shown at right. Heat is added to achieve the required end conditions The chamber contains no air. Find the temperature and steam quality when the piston begins to move Find the work done during the process and the final height of the piston at the desired condition of 300°C.

Problem 1xc) Stirling Expansion Stroke During the isothermal expansion stroke of the idealized Stirling cycle shown, the right hand piston remains fixed as the left hand piston travels downward. Problem 2xc The steam accumulator shown is used to maintain a ready source of new steam at 300°C. A piston of 63.6 metric tonnes maintains the required pressure, and the top of the cylinder is open to the atmosphere. 1 metric tonne = 1,000 kg The initial cold condition is shown at right. Heat is added to achieve the required end conditions The chamber contains no air. Find the temperature and steam quality when the piston begins to move Find the work done during the process and the final height of the piston at the desired condition of 300°C.

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To provide some perspective on the dimensions of atomic defects, consider a metal specimen with a dislocation density of 105 mm–2. Suppose that all the dislocations in 1000 mm3 (1 cm3) were somehow removed and linked end to end. How far (in miles) would this chain extend? Now suppose that the density is increased to 109 mm–2 by cold working. What would be the chain length of dislocations in 1000 mm3 of material?

To provide some perspective on the dimensions of atomic defects, consider a metal specimen with a dislocation density of 105 mm–2. Suppose that all the dislocations in 1000 mm3 (1 cm3) were somehow removed and linked end to end. How far (in miles) would this chain extend? Now suppose that the density is increased to 109 mm–2 by cold working. What would be the chain length of dislocations in 1000 mm3 of material?

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Antarctic bottom water is formed by the sinking of very cold, dense surface water. What process is primarily responsible for this increase in density? Question 17 options: freezing of sea ice melting of sea ice increase in precipitation increase in evaporation

Antarctic bottom water is formed by the sinking of very cold, dense surface water. What process is primarily responsible for this increase in density? Question 17 options: freezing of sea ice melting of sea ice increase in precipitation increase in evaporation

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When discussing homeostasis in body temperature, it is NOT true to state that the body responds to Select one: heat by stimulating sweat release. heat by constricting the blood vessels in the skin. cold by contracting the arrector pili muscles. cold by contracting skeletal muscles causing shivering. cold by rerouting blood away from the skin.

When discussing homeostasis in body temperature, it is NOT true to state that the body responds to Select one: heat by stimulating sweat release. heat by constricting the blood vessels in the skin. cold by contracting the arrector pili muscles. cold by contracting skeletal muscles causing shivering. cold by rerouting blood away from the skin.

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1. Express in your own words the meaning of these terms a. Balance b. Reaction c. Equation d. Reactant e. Product f. Dozen g. Mole Molar mass h. Reaction rate Activation energy i. Catalyst j. Equilibrium k. Dynamic equilibrium l. Chemical equilibrium Le Chatelier’s Principle m. Exergonic Endergonic n. Entropy o. Enthalpy p. Thermodynamics q. First Law of Thermodynamics Second Law of Thermodynamics

1. Express in your own words the meaning of these terms a. Balance b. Reaction c. Equation d. Reactant e. Product f. Dozen g. Mole Molar mass h. Reaction rate Activation energy i. Catalyst j. Equilibrium k. Dynamic equilibrium l. Chemical equilibrium Le Chatelier’s Principle m. Exergonic Endergonic n. Entropy o. Enthalpy p. Thermodynamics q. First Law of Thermodynamics Second Law of Thermodynamics

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Design of Electrical Systems Name: ______________________________ Note: All problems weighted equally. Show your work on all problems to receive partial credit. Resources: a) The Fundamental Logic Gate Family, Author Unknown b) Electric Devices and Circuit Theory 7th Edition, Boylestad c) Introductory Circuit Analysis 10th Edition, Boylestad d) Power Supplies (Voltage Regulators) Chapter 19, Boylestad e) Electronic Devices and Circuit Theory Chapter 5, Boylestad f) Operational Amplifiers Handout, Self g) Switch Mode Power Supplies, Philips Semiconductor h) NI Tutorial 13714-en October 6, 2013 i) NI Tutorial 13714-en V2.0 October 6, 2013 j) National Instruments Circuit Design Applications http://www.ni.com/multisim/applications/pro/ k) ENERGY STAR https://www.energystar.gov/index.cfm?c=most_efficient.me_comp_monitor_under_23_inches l) Manufactures Device Data Sheets 1) For the VDB shown below, please find the following quantities and plot the load line (Saturation / Cutoff), Q pt (Quiescent Point) and sketch input waveform and output wave form. Remember to test for Exact vs. Approximate Method. Given Bdc = hfe = 150 and RL of 10KΩ. Efficiency _ Class _____ Degrees ___ VR2_______ VE_______ VC _______ VCE ______ IC _______ IE _______ IB _______ PD _______ re’ _______ Av _______ mpp ______ Vout______ What is the effect of reducing RL to 500Ω ________________________________ What is the effect of reducing the Source Frequency to 50 Hz ________________ | | | | | | |____________________________________________ 2) For the following Networks, please complete the Truth Tables, Logic Gate Type, provide the Boolean Logic Expression. A | Vout 0 | 1 | Logic Gate Type _______ Boolean Logic Expression _________ A B| Vout 0 0| 0 1| 1 0| 1 1| Logic Gate Type _______ Boolean Logic Expression _________ A B C| Vout 0 0 0| 0 0 1| 0 1 0| 0 1 1| 1 0 0| 1 0 1| 1 1 0| 1 1 1| Logic Gate Type _______ Boolean Logic Expression _________ Operation of Transistors ____________ 3) For the Network shown below, please refer to Electronic Devices and Circuit Theory Chapter 5, Boylestad to solve for the following values: Given: Bdc1 = hfe1 = 55 Bdc2 = hfe2 = 70 Bdc Total ______ IB1 _________ IB2 _________ VC1 __________ VC2 __________ VE1 __________ VE2 __________ What is this Transistor Configuration? _______________________ What are the advantages of this Transistor Configuration? _________________________________________ _________________________________________ _________________________________________ _________________________________________ 4) Design a Four (4) output Power Supply with the following Specifications, Provide a clean schematic sketch of circuit (Please provide the schematic sketch on a separate piece of graph paper). Use a straight edge and label everything. Refer to Data Sheets as necessary. Specifications: 120 VAC rms 60 Hz Source Positive + 15 VDC Driving a 15Ω 20 Watt Resistive Load Positive +8 VDC Driving a 10Ω 2 Watt Resistive Load Negative – 12 VDC Driving a 10Ω 2 Watt Resistive Load Negative – 5 VDC Driving a 4Ω 2 Watt Resistive Load Parts available (Must use parts): 1x 120 VAC 40 Volt 3.5 Amp Center Tap Transformer 1x Fuse 1x Bridge Rectifier 12 Amp 1x LM7808 1x LM7815 1x LM7905 1x LM7912 Psource _____________ Fuse size with 25% Service Factor, 1-10 Amps increments of 1A, 10 – 50 Amps increments of 5 Amps ______ Are we exceeding Power Dissipation of any components? If so please identify and provide a brief explanation: _________________________________________________________________ _________________________________________________________________ 5) For the circuit shown below please calculate the following quantities, and Plot the Trans-Conductance Curve (Transfer Curve), (Please provide the plot on a separate piece of graph paper): You will need to refer to the 2N3819 N-Channel JFET ON Semiconductor Data Sheet Posted on Bb. VDS _________ VP ___________ VGS(off) ______ VS __________ VD __________ VG __________ PDD _________ PSource ______ VGSQ ________ IDQ __________ 6) Determine both the Upper and Lower Cutoff frequencies. Sketch Bode plot and label everything including dB Role-Off. Construct Network in Multisim and perform AC Analysis verifying frequency response and Upper and Lower Cutoff Frequencies in support of your calculations. Attach Screen shot of your Multisim Model and AC Analysis. Repeat the above for a 2nd Order Active BP Filter. You will need to research this configuration. Make sure that you use the same values for R and C. Upper and Lower Cutoff Frequencies are determined by for the 2nd Order Active BP Filter fc = 1/(2(3.14)SQRT(R1R2C1C2)). Demonstrate a change in Roll-Off from 1st Order to 2nd Order. First Order: Lower Cutoff Frequency ________ Upper Cutoff Frequency ________ Roll-Off ______________________ | | | | | | | |_____________________________________________________________ Second Order: Lower Cutoff Frequency ________ Upper Cutoff Frequency ________ Roll-Off ______________________ | | | | | | |_____________________________________________________________ 7) The following questions relate to LED Backlight LCD Monitors. (Please feel free to use more paper if need be). See Resources. Please explain the differences between LED Backlight LCD Monitor, LCD and CCFL Monitors (Cold Cathode Fluorescent Lamp) Monitors. What are some advantages of LED Backlight LCD Monitors when compared with LCD and CCFL Monitors? What color LEDs are used in the creation of an LED Backlight LCD Monitor? Does a Black Background use less energy than a White Background? If you can believe the hype, how and why are LED Backlight LCD Monitors among the most energy efficient, higher than heirs apparent? 8) In this problem the goal is to verify the Transfer Characteristics of the 2N7000G Enhancement Mode N-Channel MOSFET against the manufactures Data Sheets. Please create in Multisim a Model as exampled below. First Plot by hand on Graph Paper various VGS Voltages vs ID. Second simulate using the DC Sweep Analysis. From these results verify against the 2N7000G ON Semiconductor Data Sheet Posted on Bb, remembering that the 2N7000G ON Semiconductor Data Sheet includes both Tabulated Data and Figure 2. Transfer Characteristics. Attach all results, screen shots and write a brief description of your work. • I estimate that my mark for this exam will be: ________ % • Time spent on this exam: __________ Hours • Average of time spent per week on work for EGR-330 (outside class sessions): ______________ Hours

Design of Electrical Systems Name: ______________________________ Note: All problems weighted equally. Show your work on all problems to receive partial credit. Resources: a) The Fundamental Logic Gate Family, Author Unknown b) Electric Devices and Circuit Theory 7th Edition, Boylestad c) Introductory Circuit Analysis 10th Edition, Boylestad d) Power Supplies (Voltage Regulators) Chapter 19, Boylestad e) Electronic Devices and Circuit Theory Chapter 5, Boylestad f) Operational Amplifiers Handout, Self g) Switch Mode Power Supplies, Philips Semiconductor h) NI Tutorial 13714-en October 6, 2013 i) NI Tutorial 13714-en V2.0 October 6, 2013 j) National Instruments Circuit Design Applications http://www.ni.com/multisim/applications/pro/ k) ENERGY STAR https://www.energystar.gov/index.cfm?c=most_efficient.me_comp_monitor_under_23_inches l) Manufactures Device Data Sheets 1) For the VDB shown below, please find the following quantities and plot the load line (Saturation / Cutoff), Q pt (Quiescent Point) and sketch input waveform and output wave form. Remember to test for Exact vs. Approximate Method. Given Bdc = hfe = 150 and RL of 10KΩ. Efficiency _ Class _____ Degrees ___ VR2_______ VE_______ VC _______ VCE ______ IC _______ IE _______ IB _______ PD _______ re’ _______ Av _______ mpp ______ Vout______ What is the effect of reducing RL to 500Ω ________________________________ What is the effect of reducing the Source Frequency to 50 Hz ________________ | | | | | | |____________________________________________ 2) For the following Networks, please complete the Truth Tables, Logic Gate Type, provide the Boolean Logic Expression. A | Vout 0 | 1 | Logic Gate Type _______ Boolean Logic Expression _________ A B| Vout 0 0| 0 1| 1 0| 1 1| Logic Gate Type _______ Boolean Logic Expression _________ A B C| Vout 0 0 0| 0 0 1| 0 1 0| 0 1 1| 1 0 0| 1 0 1| 1 1 0| 1 1 1| Logic Gate Type _______ Boolean Logic Expression _________ Operation of Transistors ____________ 3) For the Network shown below, please refer to Electronic Devices and Circuit Theory Chapter 5, Boylestad to solve for the following values: Given: Bdc1 = hfe1 = 55 Bdc2 = hfe2 = 70 Bdc Total ______ IB1 _________ IB2 _________ VC1 __________ VC2 __________ VE1 __________ VE2 __________ What is this Transistor Configuration? _______________________ What are the advantages of this Transistor Configuration? _________________________________________ _________________________________________ _________________________________________ _________________________________________ 4) Design a Four (4) output Power Supply with the following Specifications, Provide a clean schematic sketch of circuit (Please provide the schematic sketch on a separate piece of graph paper). Use a straight edge and label everything. Refer to Data Sheets as necessary. Specifications: 120 VAC rms 60 Hz Source Positive + 15 VDC Driving a 15Ω 20 Watt Resistive Load Positive +8 VDC Driving a 10Ω 2 Watt Resistive Load Negative – 12 VDC Driving a 10Ω 2 Watt Resistive Load Negative – 5 VDC Driving a 4Ω 2 Watt Resistive Load Parts available (Must use parts): 1x 120 VAC 40 Volt 3.5 Amp Center Tap Transformer 1x Fuse 1x Bridge Rectifier 12 Amp 1x LM7808 1x LM7815 1x LM7905 1x LM7912 Psource _____________ Fuse size with 25% Service Factor, 1-10 Amps increments of 1A, 10 – 50 Amps increments of 5 Amps ______ Are we exceeding Power Dissipation of any components? If so please identify and provide a brief explanation: _________________________________________________________________ _________________________________________________________________ 5) For the circuit shown below please calculate the following quantities, and Plot the Trans-Conductance Curve (Transfer Curve), (Please provide the plot on a separate piece of graph paper): You will need to refer to the 2N3819 N-Channel JFET ON Semiconductor Data Sheet Posted on Bb. VDS _________ VP ___________ VGS(off) ______ VS __________ VD __________ VG __________ PDD _________ PSource ______ VGSQ ________ IDQ __________ 6) Determine both the Upper and Lower Cutoff frequencies. Sketch Bode plot and label everything including dB Role-Off. Construct Network in Multisim and perform AC Analysis verifying frequency response and Upper and Lower Cutoff Frequencies in support of your calculations. Attach Screen shot of your Multisim Model and AC Analysis. Repeat the above for a 2nd Order Active BP Filter. You will need to research this configuration. Make sure that you use the same values for R and C. Upper and Lower Cutoff Frequencies are determined by for the 2nd Order Active BP Filter fc = 1/(2(3.14)SQRT(R1R2C1C2)). Demonstrate a change in Roll-Off from 1st Order to 2nd Order. First Order: Lower Cutoff Frequency ________ Upper Cutoff Frequency ________ Roll-Off ______________________ | | | | | | | |_____________________________________________________________ Second Order: Lower Cutoff Frequency ________ Upper Cutoff Frequency ________ Roll-Off ______________________ | | | | | | |_____________________________________________________________ 7) The following questions relate to LED Backlight LCD Monitors. (Please feel free to use more paper if need be). See Resources. Please explain the differences between LED Backlight LCD Monitor, LCD and CCFL Monitors (Cold Cathode Fluorescent Lamp) Monitors. What are some advantages of LED Backlight LCD Monitors when compared with LCD and CCFL Monitors? What color LEDs are used in the creation of an LED Backlight LCD Monitor? Does a Black Background use less energy than a White Background? If you can believe the hype, how and why are LED Backlight LCD Monitors among the most energy efficient, higher than heirs apparent? 8) In this problem the goal is to verify the Transfer Characteristics of the 2N7000G Enhancement Mode N-Channel MOSFET against the manufactures Data Sheets. Please create in Multisim a Model as exampled below. First Plot by hand on Graph Paper various VGS Voltages vs ID. Second simulate using the DC Sweep Analysis. From these results verify against the 2N7000G ON Semiconductor Data Sheet Posted on Bb, remembering that the 2N7000G ON Semiconductor Data Sheet includes both Tabulated Data and Figure 2. Transfer Characteristics. Attach all results, screen shots and write a brief description of your work. • I estimate that my mark for this exam will be: ________ % • Time spent on this exam: __________ Hours • Average of time spent per week on work for EGR-330 (outside class sessions): ______________ Hours

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1 MECE2320U-THERMODYNAMICS HOMEWORK # 5 Instructor: Dr. Ibrahim Dincer Assignment Date: Thursday, 22 October 2015 Assignment Type: Individual Due Date: Thursday, 29 October 2015 (3.00 pm latest, leave in dropbox 8) 1) As shown in figure, the inlet and outlet conditions of a steam turbine are given. The heat loss from turbine is 35 kJ per kg of steam. a) Show all the state points on T-v diagram b) Write mass and energy balance equations c) Calculate the turbine work 2) As shown in figure, refrigerant R134a enters to a compressor. Write both mass and energy balance equations. Calculate the compressor work and the mass flow rate of refrigerant. 3) As shown in figure, the heat exchanger uses the heat of hot exhaust gases to produce steam. Where, 15% of heat is lost to the surroundings. Exhaust gases enters the heat exchanger at 500°C. Water enters at 15°C as saturated liquid and exit at saturated vapor at 2 MPa. Mass flow rate of water is 0.025 kg/s, and for exhaust gases, it is 0.42 kg/s. The specific heat for exhaust gases is 1.045 kJ/kg K, which can be treated as ideal gas. 1 Turbine 2 ? 1 = 1 ??/? ?1 = 1 ??? ?1 = 300 ℃ ?1 = 40 ?/? ? ??? =? ????? = 35 ??/?? ?2 = 150 ??? ?2 = 0.9 ?2 = 180 ?/? 1 Compressor 2 ???? ???? = 1.3 ?3/??? ?1 = 100 ??? ?1 = −20 ℃ ? ?? =? ? ???? = 3 ?? ?2 = 800 ??? ?2 = 60 ℃ 2 a) Write mass and energy balance equations. b) Calculate the rate of heat transfer to the water. c) Calculate the exhaust gases exit temperature. 4) As shown in figure, two refrigerant R134a streams mix in a mixing chamber. If the mass flow rate of cold stream is twice that of the hot stream. a) Write mass and energy balance equations. b) Calculate the temperature of the mixture at the exit of the mixing chamber c) Calculate the quality at the exit of the mixing chamber 5) As shown in figure, an air conditioning system requires airflow at the main supply duct at a rate of 140 m3/min. The velocity inside circular duct is not to exceed 9 m/s. Assume that the fan converts 85% of electrical energy it consumes into kinetic energy of air. a) Write mass and energy balance equations. b) Calculate the size of electric motor require to drive the fan c) Calculate the diameter of the main duct ?2 = 1 ??? ?2 = 90 ℃ ?1 = 1 ??? ?1 = 30 ℃ ?3 =? ?3 =? 140 ?3/??? 9 ?/? Air Fan

1 MECE2320U-THERMODYNAMICS HOMEWORK # 5 Instructor: Dr. Ibrahim Dincer Assignment Date: Thursday, 22 October 2015 Assignment Type: Individual Due Date: Thursday, 29 October 2015 (3.00 pm latest, leave in dropbox 8) 1) As shown in figure, the inlet and outlet conditions of a steam turbine are given. The heat loss from turbine is 35 kJ per kg of steam. a) Show all the state points on T-v diagram b) Write mass and energy balance equations c) Calculate the turbine work 2) As shown in figure, refrigerant R134a enters to a compressor. Write both mass and energy balance equations. Calculate the compressor work and the mass flow rate of refrigerant. 3) As shown in figure, the heat exchanger uses the heat of hot exhaust gases to produce steam. Where, 15% of heat is lost to the surroundings. Exhaust gases enters the heat exchanger at 500°C. Water enters at 15°C as saturated liquid and exit at saturated vapor at 2 MPa. Mass flow rate of water is 0.025 kg/s, and for exhaust gases, it is 0.42 kg/s. The specific heat for exhaust gases is 1.045 kJ/kg K, which can be treated as ideal gas. 1 Turbine 2 ? 1 = 1 ??/? ?1 = 1 ??? ?1 = 300 ℃ ?1 = 40 ?/? ? ??? =? ????? = 35 ??/?? ?2 = 150 ??? ?2 = 0.9 ?2 = 180 ?/? 1 Compressor 2 ???? ???? = 1.3 ?3/??? ?1 = 100 ??? ?1 = −20 ℃ ? ?? =? ? ???? = 3 ?? ?2 = 800 ??? ?2 = 60 ℃ 2 a) Write mass and energy balance equations. b) Calculate the rate of heat transfer to the water. c) Calculate the exhaust gases exit temperature. 4) As shown in figure, two refrigerant R134a streams mix in a mixing chamber. If the mass flow rate of cold stream is twice that of the hot stream. a) Write mass and energy balance equations. b) Calculate the temperature of the mixture at the exit of the mixing chamber c) Calculate the quality at the exit of the mixing chamber 5) As shown in figure, an air conditioning system requires airflow at the main supply duct at a rate of 140 m3/min. The velocity inside circular duct is not to exceed 9 m/s. Assume that the fan converts 85% of electrical energy it consumes into kinetic energy of air. a) Write mass and energy balance equations. b) Calculate the size of electric motor require to drive the fan c) Calculate the diameter of the main duct ?2 = 1 ??? ?2 = 90 ℃ ?1 = 1 ??? ?1 = 30 ℃ ?3 =? ?3 =? 140 ?3/??? 9 ?/? Air Fan

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What is the prime purpose of selecting a composite material over material from the other family groups? MODULE 3 – STRUCTURE OF SOLID MATERIALS The ability of a material to exist in different space lattices is called a. Allotropic b. Crystalline c. Solvent d. Amorphous Amorphous metals develop their microstructure as a result of ___________. a. Dendrites b. Directional solidification c. Slip d. Extremely rapid cooling In an alloy, the material that dissolves the alloying element is the ___________. a. Solute b. Solvent c. Matrix d. Allotrope What is the coordination number (CN) for the fcc structure formed by ions of sodium and chlorine that is in the chemical compound NaCl (salt) ? a. 6 b. 8 c. 14 d. 16 What pressure is normally used in constructing a phase diagram? a. 100 psi b. Depends on material c. Ambient d. Normal atmospheric pressure What line on a binary diagram indicates the upper limit of the solid solution phase? a. Liquidus b. Eutectic c. Eutectoid d. Solidus What holds the atoms (ions) together in a compound such as NaCl are electrostatic forces between ___________. a. Atom and ion b. Covalent bonds c. Electrons and nuclei d. Neutrons Diffusion of atoms through a solid takes place by two main mechanisms. One is diffusion through vacancies in the atomic structure. Another method of diffusion is ___________. a. Cold b. APF c. Substitutional d. Interstitial Give a brief explanation of the Lever rule (P117) Grain boundaries ___________ movement of dislocations through a solid. a. Improve b. Inhibit c. Do not affect Iron can be alloyed with carbon because it is ___________. a. Crystalline b. Amorphous c. A mixture d. Allotropic Metals can be cooled only to crystalline solids. a. T (true) b. F (false) Sketch an fcc unit cell. Metals are classified as crystalline materials. Name one metal that is an amorphous solid and name at least one recent application in which its use is saving energy or providing greater strength and/or corrosion resistance. MODULE 4 – MECHANICAL PROPERTIES Give two examples of a mechanical property. a. Thermal resistance b. Wear resistance c. Hardness d. Strength Scissors used in the home cut material by concentrating forces that ultimately produce a certain type of stress within the material. Identify this stress. a. Bearing stress b. Shearing stress c. Compressive stress An aluminum rod 1 in. in diameter (E =10.4 x 106psi) experiences an elastic tensile strain of 0.0048 in./in. Calculate the stress in the rod. a. 49,920 ksi b. 49,920 psi c. 49,920 msi A 1-in.-diameter steel circular rod is subject to a tensile load that reduces its cross-sectional area to 0.64 in2. Express the rod’s ductility using a standard unit of measure. a. 18.5% b. 1.85% c. 18.5 d. (a) and (c) What term is used to describe the low-temperature creep of polymerics? a. Springback b. Creep rupture c. Cold flow d. Creep forming MODULE 7 – TESTING, FAILURE ANALYSIS, STANDARDS, & INSPECTION Factors of safety are defined either in terms of the ultimate strength of a material or its yield strength. In other words, by the use of a suitable factor, the ultimate or yield strength is reduced in size to what is known as the design stress or safe working stress. Which factor of safety would be more appropriate for a material that will be subjected to repetitious, suddenly applied loads? Product liability court cases have risen sharply in recent years because of poor procedures in selecting materials for particular applications. Assuming that a knowledge of a material’s properties is a valid step in the selection process, cite two examples where such lack of knowledge could or did lead to failure or unsatisfactory performance. Make a sketch and fully dimension an Izod impact test specimen. Which agency publishes the Annual Book of standard test methods used worldwide for evaluation of materials? a. NASA b. NIST c. ASTM d. SPE

What is the prime purpose of selecting a composite material over material from the other family groups? MODULE 3 – STRUCTURE OF SOLID MATERIALS The ability of a material to exist in different space lattices is called a. Allotropic b. Crystalline c. Solvent d. Amorphous Amorphous metals develop their microstructure as a result of ___________. a. Dendrites b. Directional solidification c. Slip d. Extremely rapid cooling In an alloy, the material that dissolves the alloying element is the ___________. a. Solute b. Solvent c. Matrix d. Allotrope What is the coordination number (CN) for the fcc structure formed by ions of sodium and chlorine that is in the chemical compound NaCl (salt) ? a. 6 b. 8 c. 14 d. 16 What pressure is normally used in constructing a phase diagram? a. 100 psi b. Depends on material c. Ambient d. Normal atmospheric pressure What line on a binary diagram indicates the upper limit of the solid solution phase? a. Liquidus b. Eutectic c. Eutectoid d. Solidus What holds the atoms (ions) together in a compound such as NaCl are electrostatic forces between ___________. a. Atom and ion b. Covalent bonds c. Electrons and nuclei d. Neutrons Diffusion of atoms through a solid takes place by two main mechanisms. One is diffusion through vacancies in the atomic structure. Another method of diffusion is ___________. a. Cold b. APF c. Substitutional d. Interstitial Give a brief explanation of the Lever rule (P117) Grain boundaries ___________ movement of dislocations through a solid. a. Improve b. Inhibit c. Do not affect Iron can be alloyed with carbon because it is ___________. a. Crystalline b. Amorphous c. A mixture d. Allotropic Metals can be cooled only to crystalline solids. a. T (true) b. F (false) Sketch an fcc unit cell. Metals are classified as crystalline materials. Name one metal that is an amorphous solid and name at least one recent application in which its use is saving energy or providing greater strength and/or corrosion resistance. MODULE 4 – MECHANICAL PROPERTIES Give two examples of a mechanical property. a. Thermal resistance b. Wear resistance c. Hardness d. Strength Scissors used in the home cut material by concentrating forces that ultimately produce a certain type of stress within the material. Identify this stress. a. Bearing stress b. Shearing stress c. Compressive stress An aluminum rod 1 in. in diameter (E =10.4 x 106psi) experiences an elastic tensile strain of 0.0048 in./in. Calculate the stress in the rod. a. 49,920 ksi b. 49,920 psi c. 49,920 msi A 1-in.-diameter steel circular rod is subject to a tensile load that reduces its cross-sectional area to 0.64 in2. Express the rod’s ductility using a standard unit of measure. a. 18.5% b. 1.85% c. 18.5 d. (a) and (c) What term is used to describe the low-temperature creep of polymerics? a. Springback b. Creep rupture c. Cold flow d. Creep forming MODULE 7 – TESTING, FAILURE ANALYSIS, STANDARDS, & INSPECTION Factors of safety are defined either in terms of the ultimate strength of a material or its yield strength. In other words, by the use of a suitable factor, the ultimate or yield strength is reduced in size to what is known as the design stress or safe working stress. Which factor of safety would be more appropriate for a material that will be subjected to repetitious, suddenly applied loads? Product liability court cases have risen sharply in recent years because of poor procedures in selecting materials for particular applications. Assuming that a knowledge of a material’s properties is a valid step in the selection process, cite two examples where such lack of knowledge could or did lead to failure or unsatisfactory performance. Make a sketch and fully dimension an Izod impact test specimen. Which agency publishes the Annual Book of standard test methods used worldwide for evaluation of materials? a. NASA b. NIST c. ASTM d. SPE

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